Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry.Coupled with salamander chameleon harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages.To reduce thermo-mechanical loads induced

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Escherichia coli associated hematogenous sternoclavicular joint osteomyelitis: A rare condition with a rare causative pathogen

Escherichia coli is the most common microorganism that causes urinary tract infections (UTIs), including acute prostatitis.However, E.coli digiweigh digital pocket scale osteomyelitis, especially ones that involve the sternoclavicular joint, are rare hematogenous complications.We present a case of an immunocompetent man who presented with symptoms

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